Nanoveu Subsidiary EMASS Enters Chip Synthesis Phase for AIoT Revolution

Nanoveu (ASX: NVU) subsidiary Embedded AI Systems (EMASS) has entered the chip synthesis phase of its flagship ECS-DoT artificial intelligence of things (AIoT) system-on-chip (SoC) development.

The new phase follows completion of a full back-end design flow in partnership with Egypt’s Centre of Nanoelectronics, which provides world-class infrastructure in nanoscale design, SoC prototyping, and AI hardware modelling.

It leverages the advanced 16 nanometre FinFET (fin field-effect transistor) process node from Taiwan Semiconductor Manufacturing Company and marks a significant upgrade from EMASS’s current 22nm prototype, which delivers lower power consumption, higher performance, and a smaller chip size—considered critical attributes for deploying AI in energy-constrained edge environments.

Major Milestone

EMASS founder Professor Mohamed M. Sabry Aly said chip synthesis marked a major milestone in Nanoveu’s transition from simulation to silicon and positioned ECS-DoT for deployment in miniaturised, always-on intelligent systems.

“Our partnership with Centre of Nanoelectronics has been instrumental in accelerating silicon readiness and aligning our AI platform with real-world needs in high-growth markets,” he said.

Professor Aly added that EMASS had now laid the strategic foundation for ECS-DoT’s commercial rollout, which would consolidate Nanoveu’s profile as a platform leader in scalable AIoT and edge-compute markets.

Modular AIoT Kit

EMASS has launched its modular AIoT development kit offering plug-and-play daughter cards to accelerate prototyping in predictive maintenance, healthcare, and asset tracking applications.

Each module includes full schematics, hardware abstraction libraries and containerised pre-trained AI models to streamline application development.

To accelerate commercial adoption, EMASS has released a beta SDK with APIs, documentation and engineering support through an early access developer program.

Select partners will receive evaluation hardware and direct support, commencing this quarter, ahead of a broader commercial rollout.

Growing Demand

Nanoveu semiconductor division chief executive officer Mark Goranson said the modular kit reflected growing demand for turnkey AIoT integrations at the edge.

“ECS-DoT offers the performance, power efficiency, and compact form factor to drive transformative applications in environments where every milliwatt counts,” he said.

“With the launch of this platform and our first modules in predictive maintenance, healthcare, and asset tracking, we are enabling smarter systems and empowering a new generation of developers and innovators to bring edge AI to life faster than ever before.”