Nanoveu Moves Closer to Commercialisation of ECS-Dot Chipset for AI Applications

Nanoveu (ASX: NVU) has accelerated the commercialisation of its ECS-DoT chipset for extreme power efficiency and ultra-low latency AI applications, using technology developed by Taiwan Semiconductor Manufacturing Company (TSMC).

The company has made considerable progress towards tape-out and chip fabrication under the leadership of Professor Mohamed M Sabry Aly with technical oversight from Prof Yehia Ismail from the Centre of Nanoelectronics and Devices (CND) at American University in Cairo.

In April, Nanoveu’s wholly-owned subsidiary Embedded AI Systems (EMASS) secured a collaboration with CND to co-develop application-specific AI chips using TSMC’s 16nm FinFET (fin field-effect transistor).

3D Architecture

Unlike traditional planar transistors, FinFET technology uses 3D architecture to allow for more efficient control of electrical currents, resulting in lower power consumption, higher performance and greater transistor density which are critical features for building compact, ultra-efficient edge AI systems.

The integration of this process node into EMASS’s ECS-Dot AI of Things system on a chip platform is expected to deliver substantial improvements in performance-per-watt, enabling in-situ AI analytics for wearables such as health trackers and smart rings; and tiny language models in ultra-low power edge devices.

EMASS is currently expanding its sales team in the US and Europe and establishing early engagements with drone and wearables equipment manufacturers in preparation for commercialisation.

Engineering Team

Nanoveu’s ECS-DoT program is powered by 24 engineers recruited in collaboration with CND to drive full-stack innovation across analog, digital and embedded systems.

The multidisciplinary team has deep technical expertise across the full chip development stack and combines academic excellence with real-world engineering execution to ensure sustained innovation.

It includes four senior PhD-level engineers contributing advanced academic insight; five engineers with significant industry expertise; and 12 mid-level, junior and intern engineers to support the scalability all proprietary intellectual property.

Core Module Designs

Nanoveu’s 10-member analog engineering team is focused on delivering core module designs in-house including wireless circuitry, analog-to-digital and digital-to-analog converters and integrated power management units.

The modules form the foundation for low-power communication essential to edge AI applications such as wearable health monitors, smart industrial sensors, asset-tracking devices and compact robotics and autonomous systems.

Concurrently, the company’s digital engineering team is designing full-system digital architecture which integrates on-chip memory innovations, AI system optimisation techniques and advanced input/output and interface frameworks to support intelligent decision-making at the edge with minimal power draw and ultra-low latency.

These developments align with Nanoveu’s long-term objectives to deliver intelligent, energy-efficient, realtime AI hardware into commercial and industrial markets.

New Packaging

To support miniaturisation and real-world deployment, EMASS has transitioned the ECS-DoT platform to ball grid array packaging that will significantly reduce its footprint and enhance performance in space-constrained environments critical for mobile and embedded AI use cases.

Beyond this, the company is expanding its embedded systems and edge AI software development operations in Egypt and Singapore, targeting a combined team of 10 to15 engineers to support device firmware, system software integration and application enablement.

This expansion will ensure EMASS can ship its products with full software stack support, increasing adoption readiness and customer compatibility.