Nanoveu achieves 20% energy reduction with EMASS chipset for AI applications
Nanoveu (ASX: NVU) has reported that an ECS-DOT chipset developed by Embedded AI Systems (EMASS) has demonstrated 20% lower energy consumption compared to its peers, setting a new benchmark for ultra-low-power performance in edge artificial intelligence (AI) applications.
The system achieved energy consumption levels 20 times lower than industry competitor Syntiant while maintaining high levels of computational accuracy and speed.
The results validate the system-on-a-chip’s (SoC) potential to handle computationally intensive tasks such as real-time 2D-to-3D image conversion in the energy-efficient manner considered critical for applications employing Nanoveu’s EyeFly3D platform.
Energy efficiency
EMASS founder Mohamed M Sabry Aly expressed pride that ECS-DOT was able to set a new benchmark in energy efficiency.
“Achieving such low energy consumption without compromising latency is a critical step forward for the future of AI at the edge,” he said.
“These results validate our dedication to pushing the boundaries of AI performance, making our solutions ideal for applications that require real-time processing and ultra-low power consumption, such as smart home devices like security cameras and smart doorbells.”
EMASS acquisition
Earlier this month, Nanoveu announced it had secured an agreement to acquire EMASS for a consideration of $5 million worth of Nanoveu shares priced at $0.029 each, plus the issue of 83.3 million performance rights.
The acquisition is a key move in Nanoveu’s strategic plan, enabling the integration of the cutting-edge, ultra-low-power EMASS SoC technology with its proprietary EyeFly3D platform.
EyeFly3D films enable smartphones running EyeFly3D apps to generate compelling 3D experiences without the need for special glasses.
Low-power technology
The ECS-DOT system operates on just a few milliwatts of power, making it a suitable choice for applications where energy efficiency is crucial.
The SoC’s capabilities are expected to enhance the feature set of the EyeFly3D platform, specifically enabling real-time 2D-to-3D processing to support applications requiring sophisticated 3D imaging and visualisation, such as “glasses-free” 3D video calls.
Other targeted end uses include drone self-navigation, autonomous driving systems, smart home systems and security and surveillance.
Smartphone orders
Nanoveu has received a US$200,000 order from South Korea’s Rahum Nanotech Inc for the production of EyeFly3D films to fit iPhone 16 smartphones.
The order forms part of Rahum’s US$19.7m target to commercialise EyeFly3D in South Korea and marks the first purchase order received by the Fullveu Technologies (HK) joint venture between Nanoveu and manufacturing partner Shenzhen Fullsand Printing & Packaging.
The iPhone order follows Rahum’s US$180,000 order in May for EyeFly3D films to fit Samsung Galaxy Android phones.
Industry research shows Android dominates the global smartphone market with a 70.69% share, while iPhone (iOS) retains 28.58%.