Nanoveu (ASX: NVU) has received firm commitments to raise $7.5 million to support the development and commercialisation of its cutting-edge technologies including the system-on-a-chip (SoC) semiconductor developed by subsidiary Embedded AI Systems (EMASS), as well as the EyeFly3D glasses-free experience and Nanoshield antiviral and antimicrobial solar coatings.
The raising will involve the placement of 85.2 million fully-paid ordinary shares at an issue price of $0.088 each, representing a 7.41% discount to the 10-day volume weighted average price of $0.095.
New and existing investors will receive one free attaching option for every two new shares, for a total 46.2 million options exercisable at $0.15 with a three-year expiry.
Nanoveu’s directors have committed to subscribe for a combined $120,000 in the placement, subject to shareholder approval.
EMASS Semiconductor Progress
Nanoveu expects its strengthened balance sheet will position it to accelerate global expansion of the EMASS semiconductor platform, including the existing 22 nanometre solution and next-generation enhanced 16nm ECS-DoT tape-out.
The 16nm process node has progressed from architecture to final graphic data system in just six months, which is materially faster than typical advanced-node SoC timelines.
Work has included the initiation of standard technical verification, integrity checks, and bug analysis, moving toward light-mask preparation and tape-out readiness.
The milestone transforms SoC into a manufacturable silicon asset, strengthening customer engagement by shortening the pathway from demand to scalable production.
Drone Evaluation Program
EMASS is also developing a structured drone evaluation program advancing from simulation into live flight validation in collaboration with a specialist US drone firm.
Phase 2 simulation campaigns featuring more than 300 hardware-in-the-loop (HIL) runs have reported endurance gains consistently exceeding the 50% threshold across all platforms.
This has included headline gains of up to 80% for the quadcopter, up to 75% for the hexacopter under payload stress, and up to 85% for the octocopter—without changes to batteries, propulsion, or airframes.
The live program will seek to confirm the endurance improvements and control-loop performance under real-world variability, generating mission-relevant evidence to support original equipment manufacturers and system integrator engagement as results are received.
