Adisyn Subsidiary Installs New Atomic Layer Deposition System at Israeli Research Centre
Adisyn (ASX: AI1) subsidiary 2D Generation has completed the installation, commissioning and calibration of a Beneq TFS 200 atomic layer deposition (ALD) system at Israel’s Jan Koum Centre for Nanoscience and Nanotechnology.
The project follows substantial infrastructure works at the centre including an upgrade to the environmental control systems and high-specification electrical works that support the precision demands of ALD-based research.
ALD machines are used at the majority of the world’s semiconductor fabrication facilities to deposit extremely thin layers (down to an atom thickness) of material on to chips.
Customised Features
The Beneq TFS 200 model has customised features including plasma options for wafer surface treatments and potential introduction of reactive gases that catalyse graphene growth, semi-automatic load and lock enabling room temperature sample exchange and reduced heating and cooling times, and a reaction chamber suitable for wafer-scale processing.
These capabilities are essential for advancing the proprietary low-temperature graphene deposition process.
This process aims to overcome existing performance barriers in semiconductor interconnects.
Dual-System Configuration
The ALD system will operate in tandem with a primary Beneq TFS 200 at the research centre, located on the grounds of Tel Aviv University.
The dual-system configuration will allow 2D Generation to run concurrent testing and accelerate the validation of graphene films across various substrates, layer structures and operating conditions.
With both systems now in operation, the company said it would commence validating previous technical results while broadening its understanding of the building blocks for a robust and scalable process.
Major Operational Leap
Adisyn chair Kevin Crofton said commissioning of the new ALD system represented a major operational leap for Adisyn.
“The precision, flexibility and throughput of this platform enables us to rigorously test our graphene interconnect solution under real-world semiconductor conditions,” he said.
“Used in parallel with a second ALD system at Tel Aviv University, we now have a powerful dual-platform setup to accelerate development, validate performance and build a strong foundation for commercial application.”